芯 片:
采用进口感压芯片;选进的贴片工艺;
高阻抗、高精度、高稳定性;
膜片结构:厚膜型压阻式、溥膜型硅芯片、法兰型大膜片;
100万次使用寿命以上;
信号处理及输出:
24位ADC采样处理芯片;
DSP数字信号调理算法;
多点性线温度校准;
电压电流过载保护;
四位显示压力表头,显示范围:-1999-9999,采样速率:10次/S;
标准工业信号输出:4-20mA(二线制);
采用先进的32bit微处理器和24bit ADC
结 构:
厚膜结构:深度氩弧焊接,连接弹性材料与过程接头,强度高,抗冲击,耐疲劳;
溥膜结构:激光焊接,连接弹性材料与过程接头,硅油介质传递压力,响应快,耐疲劳,小量程;
工业级2088铸铝合金防爆壳体,强度可靠坚固;
整体结构小巧,过程连接方式多样化(M20X1.5,G1/2 ,ZG1/2,1/2NPT(螺纹小径≥17mm)DN50等);
过程连接材料:304或316;
应 用:
熔体/流体/粘稠性介质压力测量与控制;
工业/电力/石油/自动化等领域的设备压力测量
Chip:
Adopt imported pressure sensitive chip; select the chip technology;
High impedance, high precision and high stability;
Diaphragm structure: thick film piezoresistive, thin film silicon chip, flange type large diaphragm;
More than 1 million service life;
Signal processing and output:
24 bit ADC sampling processing chip;
DSP digital signal conditioning algorithm;
Multipoint line temperature calibration;
Voltage and current overload protection;
Four digit pressure indicator, display range: - 1999-9999, sampling rate: 10 times / S;
Standard industrial signal output: 4-20mA (two-wire system);
Advanced 32bit microprocessor and 24bit ADC
Structure:
Thick film structure: deep argon arc welding, connecting elastic material and process joint, high strength, impact resistance, fatigue resistance;
Thin film structure: laser welding, connecting elastic materials and process joints, silicon oil medium transfer pressure, fast response, fatigue resistance, small
range;
Industrial grade 2088 cast aluminum alloy explosion-proof shell, reliable and solid strength;
The overall structure is small and the process connection mode is diversified (m20x1.5, G1 / 2, ZG1 / 2, 1 / 2NPT (thread diameter ≥ 17mm) DN50, etc.);
Process connection material: 304 or 316;
Application:
Melt / fluid / viscous medium pressure measurement and control;
Equipment pressure measurement in industry / power / oil / automation and other fields
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